New Webinar Series Announced on Electronic Packaging and Interconnect Materials

Join in the live events for TMS’s new Electronic Packaging and Interconnect Materials Webinar Series, which will feature teams of subject matter experts highlighting current research topics in the electronic packaging and interconnect design community. Registration is now open, and includes all four webinars in the series. Learn more about each event:  

Each live event also offers an interactive Q&A session with the expert instructors. Visit the Electronic Packaging and Interconnect Materials Webinar Series homepage to learn more.